LTC6994IS6-2#TRMPBF Analog Devices IC DELAY BLOCK 8TAP PROG TSOT23

label:
2023/12/21 145



• Delay Range: 1µs to 33.6 Seconds
• Configured with 1 to 3 Resistors
• Delay Max Error: – <2.3% for Delay > 512µs – <3.4% for Delay of 8µs to 512µs – <5.1% for Delay of 1µs to 8µs
• Delay One or Both Rising/Falling Edges
• 2.25V to 5.5V Single Supply Operation
• 70µA Supply Current at 10µs Delay
• 500µs Start-Up Time
• CMOS Output Driver Sources/Sinks 20mA
• –55°C to 125°C Operating Temperature Range
• Available in Low Profile (1mm) SOT-23 (ThinSOT™) and 2mm × 3mm DFN
• AEC-Q100 Qualified for Automotive Applications


CATALOG
LTC6994IS6-2#TRMPBF COUNTRY OF ORIGIN
LTC6994IS6-2#TRMPBF PARAMETRIC INFO
LTC6994IS6-2#TRMPBF PACKAGE INFO
LTC6994IS6-2#TRMPBF MANUFACTURING INFO
LTC6994IS6-2#TRMPBF PACKAGING INFO
LTC6994IS6-2#TRMPBF ECAD MODELS
LTC6994IS6-2#TRMPBF APPLICATIONS


COUNTRY OF ORIGIN
Taiwan (Province of China)


PARAMETRIC INFO
Category Programmable Delay Block
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Number of Elements per Chip 1
Minimum Operating Supply Voltage (V) 2.25
Maximum Operating Supply Voltage (V) 5.5
Typical Operating Supply Voltage (V) 2.5|3.3|5
Absolute Propagation Delay Time (ns) 24(Typ)
Number of Element Inputs 1


PACKAGE INFO
Supplier Package TSOT-23
Basic Package Type Lead-Frame SMT
Pin Count 6
Lead Shape Gull-wing
PCB 6
Tab N/R
Pin Pitch (mm) 0.95
Package Length (mm) 2.9
Package Width (mm) 1.75(Max)
Package Height (mm) 0.9(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 2.9
Package Overall Width (mm) 2.8
Package Overall Height (mm) 1(Max)
Seated Plane Height (mm) 1(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Thin Small Outline Transistor
Package Family Name SOT
Jedec MO-193AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) 260
Wave Solder Time (Sec) 10
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material Ag
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix TRM
Packaging Tape and Reel
Quantity Of Packaging 500
Reel Diameter (in) 7
Reel Width (mm) 8.4
Tape Pitch (mm) 4
Tape Width (mm) 8
Feed Hole Pitch (mm) 4
Hole Center to Component Center (mm) 2
Component Orientation Q2
Packaging Document Link to Datasheet


ECAD MODELS


 
APPLICATIONS
• Noise Discriminators/Pulse Qualifiers
• Delay Matching
• Switch Debouncing
• High Vibration, High Acceleration Environments
• Portable and Battery-Powered Equipment

Hua RFQ