MAX3221IPWR Texas Instruments IC DRVR/RCVR RS-232 1-CH 16TSSOP

Function	Line Transceiver
Number of Transceivers	1
Number of Transmitters	1
Number of Receivers	1
Data Transmission Topology	Point-to-Point
Transmitter Signal Type	Single-Ended
Receiver Signal Type	Single-Ended
Transmitter Communication Type	RS-232
External Capacitor Capacitance (uF)	0.1
Power Down Mode	Power Down
Receiver Communication Type	RS-232
Charge Pump	Yes
Number of External Capacitors	4
Interface Standards	EIA/TIA-232-F\|RS-232\|V.28
Number of Transmitter Enables	1
Number of Receiver Enables	1
Number of Drivers per Line	1
Number of Receivers per Line	1
Data Rate	250Kbps
Driving Mode	3-State
Maximum Absolute Supply Voltage (V)	6
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	85
Supplier Temperature Grade	Industrial
Maximum Storage Temperature (°C)	150
Minimum Storage Temperature (°C)	-65
Power Supply Type	Single
Typical Single Supply Voltage (V)	3.3\|5
Minimum Single Supply Voltage (V)	3
Maximum Single Supply Voltage (V)	5.5
Maximum Supply Current (mA)	1
Isolation	No

Supplier Package	TSSOP
Basic Package Type	Lead-Frame SMT
Pin Count	16
Lead Shape	Gull-wing
PCB	16
Tab	N/R
Pin Pitch (mm)	0.65
Package Length (mm)	5
Package Width (mm)	4.4
Package Height (mm)	1.05(Max)
Package Diameter (mm)	N/R
Package Overall Length (mm)	5
Package Overall Width (mm)	6.4
Package Overall Height (mm)	1.2(Max)
Seated Plane Height (mm)	1.2(Max)
Mounting	Surface Mount
Terminal Width (mm)	0.24
Package Weight (g)	N/A
Package Material	Plastic
Package Description	Thin Shrink Small Outline Package
Package Family Name	SO
Jedec	MO-153
Package Outline	Link to Datasheet
Maximum PACKAGE_DIMENSION_H (mm)	1.05
Minimum PACKAGE_DIMENSION_H (mm)	N/A
Maximum PACKAGE_DIMENSION_L (mm)	5.1
Minimum PACKAGE_DIMENSION_L (mm)	4.9
Maximum PACKAGE_DIMENSION_W (mm)	4.5
Minimum PACKAGE_DIMENSION_W (mm)	4.3
Maximum Diameter (mm)	N/R
Minimum Diameter (mm)	N/R
Maximum Seated_Plane_Height (mm)	1.2
Minimum Seated_Plane_Height (mm)	N/A
Ball Array Length (mm)	N/R
Ball Array Width (mm)	N/R
Stand-off Height (mm)	0.1
Number of Column Balls	N/R
Number of Row Balls	N/R
Terminal Length (mm)	0.63
Terminal Thickness (mm)	0.15
Bottom Pad Length (mm)	N/R
Bottom Pad Width (mm)	N/R
Bottom Pad Chamfer	N/R

MSL	1
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Standard	J-STD-020D
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	Matte Sn\|Au
Under Plating Material	N/A\|Pd over Ni
Terminal Base Material	N/A\|Cu Alloy
Shelf Life Period	N/A
Shelf Life Condition	N/A
Number of Wave Cycles	N/R

• Industrial PCs

• Wired networking

• Data center and enterprise computing

• Battery-powered systems

• PDAs