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• MEDIUM-SPEED OPERATIONtPD = 30ns (Typ.) at 10V
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• STANDARDIZED SYMMETRICAL OUTPUT CHARACTERISTICS
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• QUIESCENT CURRENT SPECIFIED UP TO 20V
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• 5V, 10V AND 15V PARAMETRIC RATINGS
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• INPUT LEAKAGE CURRENT II = 100nA (MAX) AT VDD = 18V TA = 25°C
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• 100% TESTED FOR QUIESCENT CURRENT
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• MEETS ALL REQUIREMENTS OF JEDEC JESD13B " STANDARD SPECIFICATIONS FOR DESCRIPTION OF B SERIES CMOS DEVICES"
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| CATALOG |
HCF4069UBEY COUNTRY OF ORIGIN
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HCF4069UBEY PARAMETRIC INFO
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HCF4069UBEY PACKAGE INFO
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HCF4069UBEY MANUFACTURING INFO
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HCF4069UBEY PACKAGING INFO
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HCF4069UBEY ECAD MODELS
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COUNTRY OF ORIGIN
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Indonesia
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China
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PARAMETRIC INFO
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| Logic Family |
4000B |
| Process Technology |
CMOS |
| Logic Function |
Inverter |
| Number of Elements per Chip |
6 |
| Minimum Operating Supply Voltage (V) |
3 |
| Maximum Operating Supply Voltage (V) |
20 |
| Typical Operating Supply Voltage (V) |
3.3|5|9|12|15|18 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
125 |
| Maximum Propagation Delay Time @ Maximum CL (ns) |
110@5V|60@10V|50@15V |
| Absolute Propagation Delay Time (ns) |
110 |
| Propagation Delay Test Condition (pF) |
50 |
| Maximum High Level Output Current (mA) |
-2.4(Min) |
| Maximum Low Level Output Current (mA) |
2.4(Min) |
| Maximum Quiescent Current (uA) |
5 |
| Typical Quiescent Current (uA) |
0.02 |
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PACKAGE INFO
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| Supplier Package |
PDIP |
| Basic Package Type |
Through Hole |
| Pin Count |
14 |
| Lead Shape |
Through Hole |
| PCB |
14 |
| Tab |
N/R |
| Pin Pitch (mm) |
2.54 |
| Package Length (mm) |
20(Max) |
| Package Width (mm) |
7.1(Max) |
| Package Height (mm) |
5.1(Max) - 0.51(Min) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
5.1(Max) |
| Mounting |
Through Hole |
| Package Material |
Plastic |
| Package Description |
Plastic Dual In Line Package |
| Package Family Name |
DIP |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
N/R |
| Maximum Reflow Temperature (°C) |
N/R |
| Reflow Solder Time (Sec) |
N/R |
| Number of Reflow Cycle |
N/R |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
10 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
| Number of Wave Cycles |
2 |
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PACKAGING INFO
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| Packaging |
Tube |
| Quantity Of Packaging |
25 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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