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| CATALOG |
BQ25100YFPR COUNTRY OF ORIGIN
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BQ25100YFPR PARAMETRIC INFO
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BQ25100YFPR PACKAGE INFO
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BQ25100YFPR MANUFACTURING INFO
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BQ25100YFPR PACKAGING INFO
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BQ25100YFPR ECAD MODELS
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BQ25100YFPR APPLICATIONS
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COUNTRY OF ORIGIN
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China
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Philippines
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PARAMETRIC INFO
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| Type |
Linear Battery Charger |
| Battery Type |
Li-Ion|Li-Pol |
| Output Voltage (V) |
4.2 |
| Minimum Operating Temperature (°C) |
0 |
| Maximum Operating Temperature (°C) |
125 |
| Minimum Operating Supply Voltage (V) |
3.5 |
| Operating Supply Voltage (V) |
3.5 to 28 |
| Maximum Operating Supply Voltage (V) |
28 |
| Maximum Supply Current (mA) |
250 |
| Output Current (mA) |
250(Max) |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
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PACKAGE INFO
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| Supplier Package |
DSBGA |
| Basic Package Type |
Ball Grid Array |
| Pin Count |
6 |
| Lead Shape |
Ball |
| PCB |
6 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.4 |
| Package Length (mm) |
1.61(Max) |
| Package Width (mm) |
0.91(Max) |
| Package Height (mm) |
0.31(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
0.5(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Die Size Ball Grid Array |
| Package Family Name |
BGA |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
SnAgCu |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
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ECAD MODELS
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APPLICATIONS
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• Fitness Accessories
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• Smart Watches
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• Bluetooth® Headsets
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• Low-Power Handheld Devices
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