25LC256-E/SN Microchip Technology IC EEPROM 256K SPI 10MHZ 8SOIC

label:
2023/11/20 30


• Maximum Clock 10 MHz
• Low-Power CMOS Technology:
   - Maximum Write current: 5 mA at 5.5V, 10 MHz
   - Read current: 6 mA at 5.5V, 10 MHz
   - Standby current: 1 µA at 5.5V
• 32,768 x 8-Bit Organization
• 64-Byte Page
• Self-Timed Erase and Write Cycles (5 ms maximum)
• Block Write Protection:
   - Protect none, 1/4, 1/2 or all of array
• Built-In Write Protection:
   - Power-on/off data protection circuitry
   - Write enable latch
   - Write-protect pin
• Sequential Read
• High Reliability:
   - Endurance: 1,000,000 erase/write cycles
   - Data retention: > 200 years
   - ESD protection: > 4000V
• Temperature Ranges Supported:
   - Industrial (I):-40C to +85C
   - Extended (E): -40°C to +125°C
• RoHS Compliant
• Automotive AEC-Q100 Qualified


CATALOG
25LC256-E/SN COUNTRY OF ORIGIN
25LC256-E/SN PARAMETRIC INFO
25LC256-E/SN PACKAGE INFO
25LC256-E/SN MANUFACTURING INFO
25LC256-E/SN PACKAGING INFO
25LC256-E/SN ECAD MODELS


COUNTRY OF ORIGIN
China
Malaysia
Taiwan (Province of China)
Thailand


PARAMETRIC INFO
Density (bit) 256K
Interface Type Serial-SPI
Maximum Operating Frequency (MHz) 10
Maximum Access Time (ns) 50
Typical Operating Supply Voltage (V) 3.3|5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Supplier Temperature Grade Extended
Programmability Yes
I/O Mode Serial
Density in Bits (bit) 262144
Maximum Operating Current (mA) 6
Hardware Data Protection Yes
Organization 32Kx8
Data Retention (Year) 200(Min)
Minimum Operating Supply Voltage (V) 2.5
Maximum Operating Supply Voltage (V) 5.5
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Number of Bits per Word (bit) 8
Address Bus Width (bit) 16
Process Technology CMOS
 
PACKAGE INFO
Supplier Package SOIC N
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Package Length (mm) 4.9
Package Width (mm) 3.9
Package Height (mm) 1.25(Min)
Package Diameter (mm) N/R
Mounting Surface Mount
Package Description Small Outline IC Narrow Body
Package Family Name SO
Package Outline Link to Datasheet
 
MANUFACTURING INFO
MSL 1|3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy
 
PACKAGING INFO
Packaging Tube
Quantity Of Packaging 100
 

ECAD MODELS


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